1)The base Material: FR-1，FR-2,CEM-1,CEM-3,FR-4,Halogen free FR-4, Halogen, High TG FR-4.
2)Max Copper Thickness: 6OZ (210um)
3)Finished Board Thickness : 0.40mm ~ 6.0mm
4)Layers : 2 Layers ~ 28 Layers
5)Max Production Panel Size (L*W): 508 mmX 600 mm
6)Minimum Internal Layer Line/space : 3mils/3mils
7)Minimum Laser Blind Via Hole size : 0.10mm (4mils)
8)Impendance Control: +/- 5%
9)Solder mask color: Green,White,Red,Black,Blue,Yellow 10)Surface Processing: HAL,Lead-free-Hal,FlashGold , Immersion Gold/Silver/Tin, Gold Finger plating, OSP. |
