PCB Assembly capabilies
SMT major equipments
Line 1: HS50+HS23+F5+Refflo+AOI
Line 2:HS50+HF3+Refflo+AOI
Line 3: HS50+HS23+F3+Refflo+AOI
Line 4: HS50+F3+Refflo+AOI
Line 5: HS50+F3+Refflo+AOI
The capablity of assembling has been reached 6 million points per day, the capablity of DIP is 18 thousands per day.
DIP product line
Line 1. hand weling+wave soldering
Line 2. hand weling+wave soldering |