•1)The base Material: FR-1，FR-2,CEM-1,CEM-3,FR-4,Halogen free FR-4, Halogen, High TG FR-4.
•2)Max Copper Thickness:  6OZ (210um)
•3)Finished Board Thickness :  0.40mm ~ 6.0mm
•4)Layers :  2 Layers ~ 28 Layers
•5)Max Production Panel Size (L*W):  508 mmX 600 mm  
•6)Minimum Internal Layer Line/space :  3mils/3mils
•7)Minimum Laser Blind Via Hole size :  0.10mm (4mils)
•8)Impendance Control:  +/- 5%
•9)Solder mask color: Green,White,Red,Black,Blue,Yellow
•10)Surface Processing: HAL,Lead-free-Hal,FlashGold , Immersion Gold/Silver/Tin,Gold Finger plating, OSP.